Electron Microscopes
Electron Microscopy Sciences Formvar/Carbon Support Film 10 nm/1 nm thick on Gilder F2 Finder Nickel Grid
A formvar coated grid, stabilized with evaporated carbon film. This type of coating is excellent for specimen support, especially for ultra thin sections. Coated grids are optically checked followed by batch testing in the electron microscope. Packed in grid storage box. NOTE: All film is laid on the shiny side of the grid. Formvar is approximately 10 nm thick with 1 nm of carbon.
Grid: Nickel
Electron Microscopy Sciences MicroMesh™ Crystal Mount, 700 µm with 25 µm openings, 19 mm Pin length
MicroMesh Mounts are the tool of choice for microcrystal crystallography and diffraction experiments, especially at micro-focus beam-lines. They have been use in de novo protein structure determination from crystals as small as 5um.
They are excellent for rods shaped crystals, and are superior to mount with elliptical apertures, because the mesh provides continuous, gentle support for rods of all sizes.
MicroMesh produce the smallest background scatter of any commercial mount. Their sieve-like action allows easy retrieval of sub 30um crystals.
Mesh: 700 µm
Type: 25 µm openings
Pin length: 19 mm
Electron Microscopy Sciences Graphene on Thermal SiO2 on Ultra-Flat Silicon, 1 layer, 0.35 nm thick, 96.4% Transparency
CVD graphene on ultra-flat thermal SiO2. The high quality graphene is produced by chemical vapor deposition, a process by which gaseous reactants are deposited onto a substrate. The Ultra-flat Thermal SiO2 Substrate consists of a 200 nm thermally grown SiO2 film on an ultra-flat silicon wafer with a normal thickness of 675 um. The size is 5 mm x 5 mm. Graphene coverage of the TEM grid is better than 75 percent. Available in four thicknesses of CVD graphene, 1, 2, 3-5, and 6-8.
Layers: 1 layer
Thickness: 0.35 nm
Transparency: 96.4%
Electron Microscopy Sciences Light Yellow Melamine Thermosetting Hot Mount Resin 1 KG
Light yellow melamine with mineral and glass filler, thermosetting. For soft to medium hard materials. Excellent edge retention.
Electron Microscopy Sciences Black Bakelite Thermosetting Hot Mount Resin 1 KG
Black bakelite with wood filler, thermosetting. Routine examination of soft to medium hard materials. Suitable as backing.
Electron Microscopy Sciences Graphene on Lacey Carbon on 300 Mesh Cu Grid, 2 layers, 0.7 nm thick, 92.7% Transparency
CVD Graphene TEM support films supported by lacey carbon film on a 300 mesh copper TEM grid. The high quality graphene is produced by chemical vapor deposition, a process by which gaseous reactants are deposited onto a substrate. The graphene film appears as a near-transparent to light-grey film on the surface of the lacey carbon mesh on a red-brown colored copper TEM grid. Graphene coverage of the TEM grid is better than 75 percent.
Layers: 2 layers
Thickness: 0.7 nm
Transparency: 92.7%
Electron Microscopy Sciences Graphene on Thermal SiO2 on Ultra-Flat Silicon, 2 layers, 0.7 nm thick, 92.7% Transparency
CVD graphene on ultra-flat thermal SiO2. The high quality graphene is produced by chemical vapor deposition, a process by which gaseous reactants are deposited onto a substrate. The Ultra-flat Thermal SiO2 Substrate consists of a 200 nm thermally grown SiO2 film on an ultra-flat silicon wafer with a normal thickness of 675 um. The size is 5 mm x 5 mm. Graphene coverage of the TEM grid is better than 75 percent. Available in four thicknesses of CVD graphene, 1, 2, 3-5, and 6-8.
Layers: 2 layers
Thickness: 0.7 nm
Transparency: 92.7%
Electron Microscopy Sciences Graphene on Thermal SiO2 on Ultra-Flat Silicon, 6-8 layers, 2.1-2.8 nm thick, 78.5-83.2% Transparency
CVD graphene on ultra-flat thermal SiO2. The high quality graphene is produced by chemical vapor deposition, a process by which gaseous reactants are deposited onto a substrate. The Ultra-flat Thermal SiO2 Substrate consists of a 200 nm thermally grown SiO2 film on an ultra-flat silicon wafer with a normal thickness of 675 um. The size is 5 mm x 5 mm. Graphene coverage of the TEM grid is better than 75 percent. Available in four thicknesses of CVD graphene, 1, 2, 3-5, and 6-8.
Layers: 6-8 layers
Thickness: 2.1-2.8 nm
Transparency: 78.5-83.2%
Electron Microscopy Sciences AFM Substrate Type P Silicon Wafer 4", 100 mm diameter, <100> Orientation
These silicon wafers can be used for substrate studies or as substrate for AFM and SEM samples by cleaving the wafer. The wafers are polished on one side.
Diameter: 100 mm
Orientation: <100>
Thickness: 475-575 µm
Roughness: 2nm
Resistance: 1-30 ohms
Electron Microscopy Sciences Carbon Support Film 5-6 nm thick on Hexagonal 300 mesh Gold Grid
Our high quality coated grids will make your microscopy work easier and save you time. A thin film of pure carbon deposited on one side of the grid. Coated grids are optically checked and batch tested in the electron microscope. Packed in a grid storage box. Standard thickness is 5-6 nm.
Grid: Gold
Electron Microscopy Sciences Carbon Support Film 5-6 nm thick on Hexagonal 400 mesh Nickel Grid
Our high quality coated grids will make your microscopy work easier and save you time. A thin film of pure carbon deposited on one side of the grid. Coated grids are optically checked and batch tested in the electron microscope. Packed in a grid storage box. Standard thickness is 5-6 nm.
Grid: Nickel
Electron Microscopy Sciences Carbon Support Film 5-6 nm thick on Hexagonal 300 mesh Gold Grid
Our high quality coated grids will make your microscopy work easier and save you time. A thin film of pure carbon deposited on one side of the grid. Coated grids are optically checked and batch tested in the electron microscope. Packed in a grid storage box. Standard thickness is 5-6 nm.
Grid: Gold
Electron Microscopy Sciences Carbon Support Film 5-6 nm thick on Thin Bar Square 300 mesh Copper Grid
A thin film of pure carbon deposited on one side of the thin bar square grid. All of our coated grids are optically checked followed by batch testing in the electron microscope. Packed in grid storage box. Standard thickness is 5-6 nm.
Grid: Copper
Electron Microscopy Sciences AFM Substrate Type P Silicon Wafer 1", 25 mm diameter, <100> Orientation
These silicon wafers can be used for substrate studies or as substrate for AFM and SEM samples by cleaving the wafer. The wafers are polished on one side.
Diameter: 25 mm
Orientation: <100>
Thickness: 254-304 µm
Roughness: 2nm
Resistance: 1-30 ohms